Combining a computer chip with other components can lead to big performance gains
Apple’s M1 Ultra chips use advances in chipmaking called “packaging.” UltraFusion is the company’s packaging technology. It connects two M1 Max chips, and connects them to 10,000 wires that can hold 2.5 Terabytes of data per second.
“Advanced packaging is an important and evolving area in microelectronics,” Janos veres told Lifewire that Janos veres is the director of engineering at NextFlex, a consortium that advances printing of printed flexible electronic devices. Janos veres said in an interview that advanced packaging is an important and growing area in microelectronics.
A Chip Sandwich
Apple’s M1 Ultra chip is a combination of two M1 Max chips and UltraFusion, Apple’s custom-built packaging technology.
Many chip manufacturers increase their performance by connecting two chips through a motherboard. It is common for chip makers to connect two chips via a motherboard. This can lead to significant tradeoffs, including lower latency, bandwidth, and power consumption.
This allows M1 Ultra’s software recognition and behavior to be read as one chip. It doesn’t require developers to rewrite code to take advantage of its performance.
“By connecting M1 Max-sized dens to our UltraFusion package architecture, we’re in position to scale Apple Silicon up to unprecedented new heights,” Johny STrouji stated in a press release. The M1 Ultra is Apple’s most powerful personal computer chip. It boasts a powerful CPU, powerful GPU and ProRes acceleration.
The M1 Ultra has a new packaging design. It features a 20-core CPU with 16 high-performance cores and four high-efficiency cores. Apple claims that it offers a 90% better multi-threaded performance than any 16-core desktop PC chips.
Apple claims the M1 Ultra is more efficient than any other chip, and consumes 100 watts less power. This allows fans to run more quietly even when they are running complex apps.
Innovative chip packaging solutions could lead to new types of gadgets. They may be smaller and more flexible than those currently in use. This would eliminate the need for discrete components like resistors or capacitors.
Veres said that new methods of chip fabrication will enable flat electronics, origami electronics, and electronics that can be easily crushed and broken up. “
New packaging techniques for chip packaging combine different semiconductor parts with passive components. Tobias Gotschke is Senior Project Manager New Venture at SCHOTT. SCHOTT manufactures circuit board components.
SCHOTT has materials that can be used for making glass circuit boards. Gotschke said that this will enable more powerful packages with higher yields and tighter manufacturing tolerances. This will result in smaller and more environmentally-friendly chips that consume less power.